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Circuit Board Assembly Equipment:

Universal High Speed Turret     Samsung Dual Head SMT

Placement Equipment:
  • Universal turret-style, all components: 14,400 cph (3 total).
  • Sanyo turret-style, all components: 14,400 cph (2 total).
  • Sanyo turret-style, chip-shooter: 10,000 cph (3 total).
  • Sanyo automated fine pitch placement (1 total)
  • Samsung dual-head, all components: 7,500 cph (2 total).
  • Universal dual-head axial inserter:  14,000 cph per head (1 total).
  • Universal single head axial inserter (1 total)
  • Universal single head radial inserter (2 total)
  • Amistar DIP inserter (2 total)
  • Autosplice pass-through terminal inserter, 13,000 cph (1 total).
  • Seiko pick-and-place robot (1 total).
Additional Equipment:
    • Genrad "Stinger" In-Circuit Production Test System.
    • Forced Convection Reflow Ovens.
    • Wave Soldering.
    • Conformal Coating.
    • Automated Solder/Adhesive Dispensing.
    • Pass-Through Deionized Washer Systems.
    • Automatic Screen Printers.
    • Board Loaders and Unloaders.